An optimizing study of silicon-based microchannels for enhanced thermal transfer

Abstract

The thermal transport efficiency of microchannel heat sinks is critically influenced by the solid-liquid interface thermal resistance, an aspect that has historically been underappreciated in the design of these systems. We introduce a hybrid model that combines molecular dynamics simulations with computational fluid dynamics to rigorously investigate the interfacial heat transfer characteristics of microchannels. Our methodology involves constructing a nanochannel composed of silicon atoms and water molecules to accurately measure the thermal resistance at the Si–H2O interface. We then extend our analysis by developing two-dimensional rectangular microchannel models. These models are utilized to examine the effects of thermal resistance, channel dimensions, and inlet velocity on the overall interfacial heat transfer rate. Our findings indicate a pronounced size dependency in the variation of the total heat transfer rate, highlighting the critical role of scale in these systems. Significantly, enhancements in heat transfer efficiency are observed with an increase in inlet velocity and a reduction in thermal resistance. These results underscore the importance of optimizing both physical and operational parameters to enhance the efficiency of microchannel heat sinks. The findings are expected to inform future designs and promote more efficient thermal management solutions in various applications.