An optical microscopy imaging method for detection of electromigration-induced damage

Abstract

Electromigration damage is a microscopic phenomenon involving electric field-induced diffusion, which is very relevant to damage in interconnects. Recently, we have developed a novel and useful optical microscopy method with which we can visually observe and record such damage formation during an accelerated stress test. This new non-contact technique provides complementary information to the more traditional probe of electrical resistance.