Abstract
Combining Miedema model, Chou geometric model and Butler equation, the surface tension of binary system and ternary system of Sn-based lead free solder alloys was calculated, and element aggregation and surface tension factor were discussed as well. The investigation result shows that predict value is agree well with the experimental data. Moreover, basic physical parameters such as surface tension of pure metal, electronic density, molar atomic volume, electro-negativity determine surface tension factor, and the surface tension of pure metal determine the element aggregated performance in the surface of liquid Sn-based lead free solder at same time.
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