Abstract
Silicon carbide (SiC) single crystals were implanted by 5.3-MeV Kr ion, 2.3-MeV Ne ion, and 100-keV He ion with the fluence of 2.0 × 1014, 3.75 × 1015, 3.0 × 1016 ions/cm2, respectively. After ion implantation, SiC specimens were annealed at different temperatures in a high vacuum. The HRXRD measurements were used to characterize the structure damage, strain generation and their recovery processes. HRXRD results reveal that the full width at half maximum (FWHM) of the main diffraction peak broadens and new diffraction peaks appear at lower angles besides the main diffraction peak due to lattice expansions and strain occurrences caused by the implantation. Meanwhile, with increasing annealing temperature, the lattice recovery and strain relaxation occur gradually and several stages of the strain release are presented. Moreover, based on the Arrhenius model, the thermal relaxation activated energy of strains at different temperature ranges was estimated. The mechanisms on strain releases were discussed in detail.
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