Abstract
Analysis of filler particle size and distribution plays a vital role in achieving a good balance of polymer composites’ electrical, thermal, and mechanical properties. Such assessments help understand the relationship between microstructure and the physical nature of polymer composites reinforced with fillers. In this investigation, glass epoxy composites with different nano and micro-sized fillers, namely SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> , MoS <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , graphite and cenosphere, are fabricated by hand-lay technique with bagging. Particle analysis is carried out by employing image processing techniques using ImageJ. To understand the nature of hybrid filler size distribution, a comprehensive assessment of the micro and nanofiller particle distribution and the average shortest and longest separation distance between the nano and micron particles is estimated. From the particle size distribution analysis, it is observed that the micron particles are more evenly distributed than nanoparticles. The average distance between micron and nanofiller particles is observed depending on the type of filler used. The microparticles tend to surround the nanoparticles, which is desirable for decreasing the free space distances between the filler particles. Also, statistical analysis is carried out to study the experimental and estimated micron and nanofiller particle sizes used in the composites.
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More From: IEEE Transactions on Dielectrics and Electrical Insulation
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