Abstract
The diffusion behavior of the elements in the diffusion bonding based on nanostructured surface layer was studied, using the copper diffusion bonding as an example. The interlayer of nanograins and diffusion induced recrystallization zone along the interdiffusion vastly enhanced the copper diffusion, so that the bonding temperature could be lowered by more than 100°C. It thus presents a novel strategy for obtaining reliable diffusion bonding joints at low temperature. In addition, abnormal grain growth in the nanostructured materials used for diffusion bonding was observed, and the growth mechanism was further clarified by introducing the stress, along with temperature.
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