An investigation of tool and hard particle interaction in nanoscale cutting of copper beryllium

Abstract

The present study adopts molecular dynamics simulation to analyze tool and hard particle interaction in the nano-cutting of copper beryllium (CuBe). The presence of hard particles in workpiece materials affects the cutting process in terms of surface generation, material deformation, and tool wear mechanisms. Therefore, in this simulation study, three cases are considered based on the distinct size and location of hard particle in the base material. Results show that Be particle, when encountered by a diamond tool at the cutting plane, is suppressed and subsequently is projected from the generated surface with a dig left behind the particle. Furthermore, particle removal or suppression depends on its size and location with respect to the cutting plane. Shockley partial dislocations are noticed to be dominant in plastically deforming the workpiece material. Moreover, it is not only the workpiece surface which gets affected; hard particle also deteriorates the tool by causing wear to its cutting edge. The cutting process – in terms of surface generation, material deformation, and tool edge condition – is found to be dependent on the crystallographic planes of the base material.