An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses

Abstract

The contact behavior of a commercial elastomer interconnect, composed of silicone rubber and silver particles, was evaluated under thermal and mechanical stresses. Its contact resistance demonstrated a linear relationship in a log-log plot with contact force at room temperature; however, a deviation of the trend occurred when temperature was changed. With the interconnect compressed under a constant force, a fluctuation in contact resistance was initiated by a change of temperature. This phenomenon may be attributed to the inherent conduction mechanisms of the elastomer interconnect. The multiple interfaces between metal particles make the contact sensitive to a variety of factors. This sensitivity may have a direct impact on its long-term reliability.