Abstract
As well known, the sandwich-like construction is the classic unit construction of MEMS microthrusters, and these three layers should be bonded between the igniting circuit layer and the microchamber-array-layer, the microchamber-array-layer and the micronozzle-array-layer. It’s bonded by BCB between the igniting circuit layer and the microchamber-array-layer, and their bonding strength is the key factor to determine the reliability of MEMS microthruster-array-chips. And the failure is mostly discovered on the bonding surface of the igniting circuit layer and the microchamber-array-layer in ignition experiments. For solving the bonding failure, the failure reason will be analysed and the improved bonding technique is designed. Here, the bonding strength is externalized, and the average shear strength increase to 11.63MPa from 2.80Mpa, this is over 4times than before. The igniting experiments prove the Si3N4 layer can enhance the BCB bonding strength and this new bonding method does solve the bonding problem of MEMS microthruster-array-chips.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
