Abstract
Copper wires are used in electronic packaging, however the workability and reliability still need to be improved. This work investigates the microstructural characteristics and mechanical properties of annealed wires and un-annealed wires. In addition, the interface bonding characteristics of Al pads are also studied. Experimental results indicate that at the two annealing conditions of 610 °C/0.02 s and 510 °C/0.4 s, 20 μm copper wires possessed a fully annealed structure. Compared with the un-annealed wire, the annealed tensile strength and the annealed hardness decreased, and the annealed elongation increased. Through thermal crystallization, the matrix structure transformed from long, thin grains to equiaxed grains and a few annealed twins. The microstructure of the free air ball (FAB) after an EFO process consisted of column-like grains, and grew from the heat-affected zone (HAZ) to the Cu ball. As for bonding testing, the pull strength of the bonded samples increased with increasing the Al film thickness (from 76 nm to 800 nm).
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