An Interface Anticrack in a Periodic Two–Layer Piezoelectric Space under Vertically Uniform Heat Flow

Abstract

Abstract This paper aims to investigate 3D static thermoelectroelastic problem of a uniform heat flow in a bi-material periodically layered space disturbed by a thermally and electrically-insulated rigid sheet-like inclusion (so-called anticrack) situated at one of the interfaces. An approximate analysis of the considered laminated composite is given in the framework of the homogenized model with microlocal parameters. Accurate results are obtained by constructing suitable potential solutions and reducing to the corresponding homogeneous thermoelectromechanical (or thermomechanical) anticrack problems. The governing boundary integral equation for a planar interface anticrack of arbitrary shape is derived in terms of a normal stress discontinuity. As an illustration, a complete solution for a rigid circular inclusion is obtained in terms of elementary functions and interpreted from the failure perspective. Unlike existing solutions for defects at the interface of materials, the solution obtained displays no oscillatory behavior.