An Intercell Busbar Topology to Surpass Anomalies of Copper Electrorefining Processes

Abstract

In copper electrorefining, process anomalies impair current efficiency and productivity. Short circuits produce nodules or dendrites in copper cathodes, impaired contacts at busbars elevate current densities dispersion and, open contacts result in blank cathodes and overcurrents at nearby electrodes. This paper presents an intercell topology composed by a base board, main anode–cathode connectors, and a capping board with secondary connectors snapped on top. With this segmented intercell configuration the resilience to anomalies is improved by reducing short-circuit occurrence and their magnitude. Anomalies are pinpointed in 60 s with the addition of light mass secondary connectors placed on the capping board. Moreover, the new topology is capable of surpassing anomalies even without assistance to sustain production. Finite-element modeling predicts the performance of the proposed innovation for fast detection of short and open circuits using thermography scans. The paper includes experimental results to validate the effectiveness of the secondary connectors in the detection of process anomalies.