Abstract
In this paper, an integrated system [predicting solder interconnection shapes (PSIS)] is built to predict and analyze the shape of solder interconnections in electronic packaging. The purposes are to numerically simulate the formation of solder joints, analyze the shape of solder joints and its influential factors and provide an efficient tool for design and manufacturing engineers to improve the integrity of solder interconnections. The formation of solder joints is numerically simulated through a surface evolver program and the calculation is automated with an additional controller. A datafile generator is developed in which the potential energies, geometry of the conjunction and boundary conditions of the initial solder joint can be generated visually and transferred into evolver syntax automatically. A post processor is built to analyze the global three-dimensional (3-D) shape and cross section profiles of solder fillets. Also, the applications for solder interconnection shape prediction of chip component (RC3216) are conducted with this system.
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