Abstract

An innovative approach to characterize the resistance of adhesively bonded joints to fatigue disbond propagation (FDP) is presented. A constitutive equation, known as the modified crack layer (MCL) model, is employed to extract parameters characteristic of the adhesive joint's resistance to FDP. These parameters are γ', the specific energy of damage, which reflects the fatigue disbond resistance of the adhesive joint and the dissipative characteristic of the joints, β'. Stress-controlled tension-tension fatigue experiments were conducted on lap joints fabricated from aircraft grade aluminum 2024-T3 and 3M structural adhesive. The disbond length was measured periodically along the edges of the bonded area at the four corners and the corresponding number of cycles was recorded. This is in order to calculate the disbond growth rate. The hysteresis loop was also recorded for each measurement from which both the energy release rate, J*, and the change in work, Wi, were determined. It was found that the proposed model describes the behavior of the adhesively bonded joints over the entire range of the energy release rate. Thus, the proposed model can provide a basis upon which the relationships between the microstructure and/or the processing conditions and the resistance of adhesively bonded joints to FDP can be constructed. Such relationships can guide the development of adhesively bonded joints with superior resistance to debonding and should aid in their lifetime assessment.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.