Abstract
Junction temperature is a key parameter that influences both the performance and the reliability of the insulated gate bipolar transistor (IGBT) module, while solder fatigue has a significant effect on the accuracy of junction temperature estimates using the electro-thermal model. In this paper, an improved electro-thermal model, which is independent of solder fatigue, is proposed to accurately estimate the junction temperature of IGBT module. Firstly, solder fatigue conditions are monitored in real time with the information of the case temperatures. Secondly, when solder fatigue is found, the update process of the electro-thermal model parameters is performed to match the model parameters with the fatigue device. With the above two-step process, the influence of solder fatigue on the accuracy of temperature estimates can be removed in good time. Experimental results are provided to validate the effectiveness of the proposed method.
Highlights
In recent decades, insulated gate bipolar transistor (IGBT) modules are more common in automotive and rail-traction applications due to its excellent performance in switching speeds, conduction losses, and over-current capacity [1,2,3]
An improved electro-thermal model, which is able to remove the influence of solder fatigue on the accuracy of junction temperature estimate, was proposed in this paper
The conditions of solder fatigue were detected in real time with the proposed monitoring parameter k, that is based on the case temperatures
Summary
In recent decades, insulated gate bipolar transistor (IGBT) modules are more common in automotive and rail-traction applications due to its excellent performance in switching speeds, conduction losses, and over-current capacity [1,2,3]. Compared with the optical and electrical method, the electro-thermal model just needs the device power losses and the case temperature to obtain the junction temperature. In [29,30], the changes of thermal impedance caused by solder fatigue is assessed and used to update the parameters of the electro-thermal model This process has to be off-line to eliminate the effect of operation conditions on the measurement circuit. Another main issue is how to find solder fatigue in time and update the model parameters . Motivated by the analysis described above, in this paper, an improved electro-thermal model which is able to monitor solder fatigue in time and update model parameters is proposed.
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