Abstract

Thermal energy storage technology plays an important role on improving energy usage flexibility for the end users. The spherical stacking latent thermal energy storage devices inherits the advantages of direct thermal energy usage efficiency and simplified practical applications that received widely attentions. However, due to dispersed and multi-layer structural arrangement, the non-ignorable dynamic heat transfer process poses difficulties in the device design and operation control. In this study, an improved analytical model for predicting the transient heat transfer process of spherical stacking devices is developed. After verification, the parameter sensitivity analysis of the device is conducted by using the model. The results show that the dynamic change trend of thermal resistance is distinct for the melting and the solidification process. The developed model can dynamically predict the outlet temperature of heat transfer fluid and the heat transfer efficiency in a good agreement, and the prediction error of outlet temperature during solidification can reach −2.49 %–4.70 %. The correlation between sphere radius and heat transfer rate is negative and reaches a kind of high correlation above 0.8 for solidification process. The inlet temperature and the mass flow rate of heat transfer fluid are the most influential parameters for melting process.

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