An experimental study on the heat dissipation of LED lighting module using metal/carbon foam

Abstract

In this study, thermal performance of the cooling modules applicable for Par 38 light bulb is investigated. A total of six heat sink modules, including the basic reference design, metal foam, and carbon foam are tested and compared. Tests are performed and analyzed using the transient test method based on JESD51-1 standard. It is found that the thermal resistance from junction to die attach is quite small. By contrast, the thermal resistance of the heat sink dominates the total resistance, and it comprises 55% of the total resistance for the standard heat sink module. With some slight opening on the base plate, the thermal resistance can be improved by approximately 12%. The thermal resistance for the carbon foam having an embedded metal plate shows the least thermal resistance of 1.14K/W, followed by the carbon foam, and then the metal foam. The lower thermal resistance of carbon foam in association with copper metal foam is due to its higher emissivity. In addition to better heat transfer performance as compared to the standard plate heat sink, the utilization of carbon foam and metal foam can also significantly reduce the weight of the heat sink. In this study, the weight of the heat sink can be reduced as much as 33%.