Abstract

ABSTRACTIn this study, a spray cooling device for electronic components was investigated. Dielectric fuid (FC-72) was sprayed at 50°C through five nozzles (4.243mm spacing). The nozzles are of diameters 0.17, 0.23 or 0.41mm. Volume flow rate varied from 24.5 to 99.1ml/min. Two grooved surfaces and a smooth surface were tested, and the heated area was 12 × 12mm2. The larger nozzles yielded greater heat transfer coefficients at high heat fluxes (300 ∼ 600kW/m2). However, smaller nozzles result in greater dry-out heat fluxes and greater heat transfer coefficients at heat flux < 300kW/m2. The C4 surface, having parallel grooves of 0.4mm depth, improved the spray cooling performance by up to 80% as compared with the smooth suface. Its thermal resistance is 0.11 ∼ 0.12K/W at 99.1ml/min flow rate, in the range of 85 ∼ 130W heat input. A new correlation of spray cooling, accounting for the contributions of nucleate boiling and spray convection, is proposed. For data of FC-72 in the range of Re = 856 ∼ 6188, Bo = 0.19 ∼ 5.70, We = 25.2 ∼ 3541.3, the predicted h-values agree with experimental data of the smooth surface within ±25%.

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