Abstract
The development of small electric devices is crucial to the digital age, but due to space limitations and irregular surfaces, it is challenging to dissipate heat through an external medium. The existing Phase Change Material (PCM) has limits due to its brittleness, which prevented it from occupying the irregular surfaces of tiny electronic devices and from experiencing deformations while in use (FPCM). In this study, samples of the more recent thin film FPCM are made utilising olefin block copolymer and paraffin wax in various mass combinations. This study outlines the best PCM and copolymer selection, FPCM fabrication, and a thorough examination of sample report and electronic device applications. The information in this study can be used to implement and improve phase shift thermal management strategies in electronic equipment. In the future, thermal analysis will be researched.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
