An experimental study of ultrasonic vibration-assisted grinding of polysilicon using two-dimensional vertical workpiece vibration

Abstract

An experimental study of polysilicon grinding with ultrasonic vibration assistance was presented. The two-dimensional (2D) vertical vibration was applied on the workpiece directly and vibrated perpendicular to both the workpiece and grinding wheel. The grinding forces were measured using a three-component dynamometer, and the surface conditions were examined using a surface profilometer and a laser microscope. The experimental results showed that the grinding force and surface roughness with ultrasonication were much less than those in conventional grinding. In the case of ultrasonication, the wheel speed and worktable feed rate would have a more positive effect on the grinding force decrement/increment, especially for the tangential force while the wheel depth of cut had a negative effect. The surface condition of the ground polysilicon surface was improved with the assistance of ultrasonication. This research indicated that the 2D ultrasonic vibration-assisted grinding technique can be an effective method for the high-efficiency machining of hard brittle polysilicon material.