Abstract
This article experimentally studies a thermocapillary rupture of a locally heated horizontal liquid film on substrates of different materials and different thickness. In the course of work the dependence of the critical heat flux on the initial and final film thickness was determined. Upon reaching the heat flux and film thickness at which the liquid film boils up, the film disrupts at almost constant finite thickness. The research has shown that with an increase in thermal conductivity and thickness of the substrate the critical heat flux increases. On the substrates of a material with high thermal conductivity (copper) the heat flux is redistributed on the substrate; at that the localization of heating is lost, and the rupture is not observed.
Highlights
IntroductionThin liquid films are promising for cooling equipment with high local heat generation, in particular, highperformance electronics [1,2,3]
The devices using liquid film flows are widely used in industry
The decrease in film thickness allows enhancing heat and mass transfer; thin films are susceptible to ruptures, which leads to a drastic increase in the temperature of the cooled section and its failure
Summary
Thin liquid films are promising for cooling equipment with high local heat generation, in particular, highperformance electronics [1,2,3]. Thermocapillary rupture of flowing liquid films under local heating were studied in [46]. Influence of substrate wettability and liquid properties on thermocapillary rupture of flowing films was studied in [7,8,9]. The works [7, 13] showed that the critical heat flux for horizontal liquid films may several times exceed the heat flux for the films flowing under the action of gravity. This explains the motivation of our work
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