Abstract
The use of sonic energy in the 0.8 to 1.0 MHz range, commonly known as megasonic cleaning, has been shown to be effective in the removal of particles from silicon wafers in aqueous baths. Megasonic cleaning at a nominal frequency of 862 kHz is investigated experimentally. The effects of particle size, power, and sonication time on the particle removal efficiency are evaluated for submicron PSL, , and particles on silicon wafers using both DI water and SC1 (, first used at RCA) chemistry. The removal efficiency is known to be higher in SC1 than in DI water, and in both cases it is a function of irradiation time and particle size. Increased power is also shown to increase removal efficiency.
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