An Evaluation of the Residual Stress Singularity of Different Material Bonded Joints by Bond Element Method. Effect of Interfacial Slip in Different Material Wedges.

Abstract

It is important to obtain information on the effect of the interfacial slip, which is induced by the thermal activation process in different material bonding processes to execute the interfacial fracture analysis. In this paper, the effect of the interfacial slip in different material bonding processes on the stress singularity at the free edge was studied by finite element method (FEM) with bond elements. The results are as follows. Another stress singularity field was produced at the slip tip, although the interfacial slip released the stress singularity at the free edge. The stress field was found to resemble the crack problem, so that the singular stress field was evaluated by the stress intensity factor.