Abstract
The application of the partial transient liquid phase bonding (PTLPB) process for joining silicon nitride ceramics using microdesigned Au Ni Cr Au multilayer interlayers has been investigated. The influence of different bonding parameters, such as time, temperature and interlayer thickness, on the microstructure and chemistry of the ceramic-metal interfaces has been studied. Scanning electron microscopy and electron probe microanalysis investigations revealed that the ceramics were bonded to the NiCr foils by a thin CrN reaction product layer while the Au had alloyed to form a Ni rich solid solution. Joints with room temperature average flexural strength of 272 MPa, were produced under optimized bonding conditions of 4 h at 1000°C. These processing conditions resulted in joints with microstructure and strength equivalent to those obtained by optimized diffusion bonding procedures. The effect of post-bonding annealing in air at 800°C for 60 h on the room temperature joint strength was also assessed.
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