An eugenol-based siloxane resin with low viscosity, low dielectric constant, and high mechanical properties

Abstract

One of the most prominent research topics currently is the development of a multi-functional, low-viscosity epoxy resin with exceptional flame retardancy, high strength, high toughness, low dielectric loss, and hydrophobicity. This resin holds significant potential for applications in the fields of electronics and electricity. However, achieving all these properties simultaneously poses a considerable challenge. To address this problem, a new epoxy resin with symmetrical structure containing silica was designed using dichlorodiphenyl silane and biobase compound eugenol as raw materials through molecular design. Comparative analysis with DGEBA/DDM revealed that ESR/DDM exhibits a remarkable increase in Young's modulus by 57.5 % and impact strength by 132.1 %. Moreover, within a wide frequency range (10–106 Hz), ESR demonstrates lower dk values (0.75–0.95) compared to DGEBA (3.3–3.5), indicating reduced absorption of electric energy under alternating electric fields' influence. The contact angle of ESR/DDM epoxy material measures at 113.56° - an impressive enhancement of 29.8 % compared to DGEBA/DDM counterparts. In summary, ESR represents a hydrophobic material possessing low viscosity, low dielectric constant, and superior mechanical properties. The findings of this study offer a novel perspective for advancing the development of bio-based epoxy resins with enhanced performance and multifunctionality.