Abstract
Recently, many small microphones installed in cellular phones are the electret condenser microphones (ECMs) that contain an organic film diaphragm. Although FEP of fluorocarbon polymer is generally used as the electret material, silicon dioxide is also used. Recently ECMs have been made small and thin while maintaining the basic sound performance according to the market demand. In addition, environment tests and the reflow soldering mounting process have been adjusted to meet market requirements. On the other hand, the examination satisfied the demand as the high temperature resistance was insufficient. This paper depicts an examination and a comparison of conventional ECM with the experimental model, a silicon diaphragm condenser microphone produced using the MEMS method. The silicon diaphragm satisfies high-temperature resistance and stable temperature characteristics because of its very small coefficient of linear expansion and it is measured total harmonic distortion (THD) on high pressure sound. Finally, it will be able to be used in high temperature and high pressure sound conditions in the future.
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