Abstract
An earlier energy-based fatigue damage model [1] has been examined to evaluate the durability of micro-sized silicon components subjected to cyclic loads. The components of this model are based on the physics of crack initiation and damage progress on the most damaging planes. Fatigue damage accumulation of silicon micro-components is accompanied with the formation of inclined micro-critical planes of {111} on the fracture surface as a means of dissipating energy during the fatigue damage progress, which in principal coincides with the mechanism of fatigue damage accumulation in Varvani’s approach [1]. Predicted fatigue lives based on the damage model were found in a good agreement with experimental fatigue life data of these components reported in the literature. Correlations are within a factor of ±2.5 for short and long lives, which are within the limits of acceptance.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.