An embedded statistical method for coupling molecular dynamics and finite element analyses

Abstract

AbstractThe coupling of molecular dynamics (MD) simulations with finite element methods (FEM) yields computationally efficient models that link fundamental material processes at the atomistic level with continuum field responses at higher length scales. The theoretical challenge involves developing a seamless connection along an interface between two inherently different simulation frameworks. Various specialized methods have been developed to solve particular classes of problems. Many of these methods link the kinematics of individual MD atoms with finite element (FE) nodes at their common interface, necessarily requiring that the FE mesh be refined to atomic resolution. Some of these coupling approaches also require simulations to be carried out at 0 K and restrict modelling to two‐dimensional material domains due to difficulties in simulating full three‐dimensional material processes. In the present work, a new approach to MD–FEM coupling is developed based on a restatement of the standard boundary value problem used to define a coupled domain. The method replaces a direct linkage of individual MD atoms and FE nodes with a statistical averaging of atomistic displacements in local atomic volumes associated with each FE node in an interface region. The FEM and MD computational systems are effectively independent and communicate only through an iterative update of their boundary conditions. Thus, the method lends itself for use with any FEM or MD code. With the use of statistical averages of the atomistic quantities to couple the two computational schemes, the developed approach is referred to as an embedded statistical coupling method (ESCM). ESCM provides an enhanced coupling methodology that is inherently applicable to three‐dimensional domains, avoids discretization of the continuum model to atomic scale resolution, and permits finite temperature states to be applied. Published in 2009 by John Wiley & Sons, Ltd.