Abstract
Thermal resistance induced by imperfectly bonded interfaces is closely related to failure at small scales. In this work, a nonlocal Kapitza thermal resistance model is constructed based on peridynamics. An embedded discontinuity model is formulated to capture the temperature jump condition induced by the interfacial thermal resistance. The model inherits the nonlocality of peridynamics but also captures the key physics of the interfacial heat barrier. To overcome the efficiency bottleneck of peridynamics, an implicit numerical procedure is formulated for both steady-state and transient-state solutions. The model is verified with various numerical examples quantitatively and shows a good agreement with analytical solutions by the classical heat conduction theory. Overall speaking, the proposed model extends the application of peridynamics in modeling general interface behaviors and establishes a foundation for predicting thermal-induced interfacial failure problems.
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