Abstract
A layout-pattern-dependent electroplating model is developed based on the physical mechanism of the electroplating process. Our proposed electroplating model has an advantage over former ones due to a consideration of the variation of copper deposition rate with different layout parameters during the process. The simulation results compared with silicon data demonstrate the improvement in accuracy.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
