Abstract
An etchant-free surface pre-treatment process for the preparation of copper/soybean protein fiber (Cu/SPF) via electroless plating was studied. A tight, dense and continuous structure of copper coating was obtained in this process. 3-Aminopropyltrimethoxysilane molecule was successfully grafted onto the SPF via a simple coupling reaction. In addition, Au, Ag or Pd nanoparticles were immobilized on the SPF substrate as catalyst sites for electroless plating. All the copper coatings via different metal activation were firmly adhered to the SPF substrate, as determined by an adhesive scotch®-tape test. The measurement of the electrothermal property of the Cu/SPF composites was carried out by a home-made direct current circuit. The composite from Ag activation process held a relatively higher rated current and a lower melting point, which indicated that it was more suitable to be made as the fuse wire than the composites from Au or Pd activation process.
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