An Efficient Domain Decomposition Method in Multi-physics Simulation of Package Systems

Abstract

With the continuing downscaling in feature sizes, the thermal impact on material properties and geometrical deformation cannot be ignored anymore in the design and EMC analysis of modern electronic systems. We present a high-performance program for parallel multi-physics simulation of electronic electromagnetic problems. This program is intended to perform large-scale multi-physics simulation using finite element method (FEM), a highly efficient domain decomposition method (DDM) is introduced to accelerate the loops of electromagnetic-thermal-stress couplings, since it is very consuming of electromagnetic simulation when faced with real-life large-scale package systems. The domain decomposition scheme enables simulation with many processors in parallel and achieves significant reduction in computation time.