Abstract

In this paper a closed-form matrix rational model for the computation of step and finite ramp responses of Resistance Inductance Capacitance (RLC) interconnects in VLSI circuits is presented. This model allows the numerical estimation of delay and overshoot in lossy VLSI interconnects. The proposed method is based on the U-transform, which provides rational function approximation for obtaining passive interconnect model. With the reduced order lossy interconnect transfer function, step and finite ramp responses are obtained and line delay and signal overshoot are estimated. The estimated delay and overshoot values are compared with the Eudes method, Pade method and HSPICE W- element model. The 50% delay results are in good agreement with those of HSPICE within 0.5% error while the overshoot error is within 1% for a 2 mm long interconnect. For global lines of length more than 5 mm in SOC (system on chip) applications, the proposed method is found to be nearly four times more accurate than existing methods.

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