An efficient approach to fabricate lightweight polyimide/aramid sponge with excellent heat insulation and sound absorption performance

Abstract

Polyimide sponges have bright prospects in the weight reduction, heat insulation, and sound absorption equipment of aerospace, navigation, and other area due to their unique three-dimensional cellular structure and outstanding comprehensive performance. However, most polyimide sponges suffered from long and complex fabrication processes. Herein, an efficient and scalable approach, i.e. water-based foam forming, was proposed to fabricate ultralight and porous polyimide/aramid sponges (PASG). Attributed to the bubble-template nature of foam-forming, PASGs exhibit high porosity (>99%) and ultra-low density (∼10 mg/cm3), and possess excellent thermal and sound insulation performance with an optimum thermal conductivity of 34.89 mW/m·K and noise reduction coefficient of 0.41. Besides, PASGs demonstrate outstanding mechanical properties after 500 compression cycles. This strategy providing more possibilities for developing the next generation of high-performance thermal insulation and noise reduction materials.