Abstract

Two-photon lithography (TPL) plays a vital role in microstructure fabrication due to its high processing accuracy and maskless characteristics. To optimize the manufacturing quality deteriorated by the defocus of the substrate, an autofocus approach based on improved differential confocal microscopy (IDCM) is proposed in this paper. Through analyzing the intensity response signals from two detectors with symmetrical axial offset, the defocus amount is measured and compensated for with high precision and noise immunity to stabilize the substrate. The verification experiments on the coverslip reported a detection sensitivity of 5 nm, a repetitive measurement accuracy of less than 15 nm, and a focusing accuracy reaching around 5 nm. The consistency between simulation and characterization demonstrated the effectiveness and superior performance of the autofocus system for the high production quality of the metalens array. The proposed autofocus method shows promise for further application to the fabrication of complex structures on various substrates.

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