An Approach Towards Optimization Appraisal of Thermal Conductivity of Magnetic Thermoplastic Elastomeric Nanocomposites Using Response Surface Methodology.

Moayad Husein Flaifel

doi:10.3390/polym12092030

Moayad Husein Flaifel

Open Access

https://doi.org/10.3390/polym12092030

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Journal: Polymers	Publication Date: Sep 6, 2020
Citations: 15	License type: CC BY 4.0

Affiliation: Imam Abdulrahman Bin Faisal University

Abstract

This study investigates the optimization of thermal conductivity of nickel zinc ferrite incorporated thermoplastic natural rubber nanocomposites using response surface methodology (RSM). The experimental runs were based on face-centered central composite design (FCCD) where three levels were designated for both temperature and magnetic filler content. The analysis of variance (ANOVA) results showed that the implemented technique is significant with an F-value of 35.7 and a p-value of <0.0001. Moreover, the statistical inference drawn from the quadratic model suggests a saddle response behavior the thermal conductivity took when both factors were correlated. The factors’ optimal set confined within the practical range led to a thermal conductivity of 1.05 W/m·K, a value which is believed to be associated with an optimal percolated network that served as efficacious thermal pathways in the fabricated nanocomposites. These results are believed to contribute to the potential employability of magnetic polymer nanocomposites (MPNCs) in electronic packaging applications.

Highlights

In the past decade, rising demand in the ever-changing world on electronic products with high level specifications has put researchers and engineers in the face of various challenges, most important of which is the ease of heat dissipation that becomes such an imperative issue, especially when the device possesses high power density and miniaturized size [1,2,3]
magnetic polymer nanocomposites (MPNCs) offer themselves as one of the promising candidates in the electronic packaging arena due to the synergistic effect that comes from the inclusion of magnetic nanoparticles with good thermal conductivity and its polymeric matrix that is chosen based on its good mechanical properties, excellent thermal and electrical resistance, good processability, light weight, and low cost [22,23,24]
The optimization of thermal conductivity of the nanocomposites represented by a response surface was implemented based on the variation of values set of temperature and magnetic filler content

Summary

Introduction

In the past decade, rising demand in the ever-changing world on electronic products with high level specifications has put researchers and engineers in the face of various challenges, most important of which is the ease of heat dissipation that becomes such an imperative issue, especially when the device possesses high power density and miniaturized size [1,2,3] For this reason, a great effort has been exerted in looking for suitable materials that can meet the performance and reliability criteria set by the electronic packaging industry [4,5,6,7,8]. One of the themes of this work is to highlight the potential importance of such materials in the electronic packaging arena

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Results

Conclusion