Abstract
A plasma-chemical reactor with the coupling of gas-discharge processes has been developed. These processes combine arc evaporation of titanium in a nitrogen-containing plasma and ion-plasma sputtering of copper with the formation of copper vapor. Experiments were carried out on the deposition of superhard nanostructured TiN−Cu composite layers.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have