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Abstract
Liquid metals (LMs) offer extremely low thermal resistance, and have been studied as an emerging thermal interface material (TIM). In this work, we propose an improved form of LM/indium film/LM sandwich pad as an efficient TIM. The sandwich-like structure was designed to avoid liquid leakage and oxidation of LM, and additional micropillar arrays were fabricated on the surface, which benefitted the improved wetting of the substrate surface. A series of thermal tests revealed the anti-leakage characteristic and thermal stability of LM/indium film/LM, whose thermal resistance can also reach as low as 0.036 cm2 K W−1. Additionally, the heat dissipation test performed on a commercial smart phone demonstrated that a LM/In/LM pad not only reduced the temperature of the CPU and back cover but also enhanced the runtime of a battery by 25%
Highlights
Given the continual increase in integration level and assembly density, electronic components generate a large amount of heat that cannot be dissipated timely and efficiently
We proposed an improved form of Liquid metals (LMs)/indium lm/ LM sandwich with micropillar arrays pad as thermal interface material (TIM) to meet practical applications for electronic components
High thermal conductivity of 44 W mÀ1 KÀ1 was calculated from thickness versus thermal resistance curve; this value is higher than that of most TIMs that have been reported
Summary
Given the continual increase in integration level and assembly density, electronic components generate a large amount of heat that cannot be dissipated timely and efficiently. Using thermal interface materials (TIMs) is an effective way to reduce thermal contact resistance to achieve fast and efficient heat transfer.[7,8]. We considered extra InSnBi LM layers on the top and bottom of the indium foil to facilitate the low interface thermal resistance. In such a sandwich structure, when the CPU temperature rises above the melting point of LM, the LM expectedly melts and wets the CPU's and heatsink's surface. The micropillar arrays were imprinted on the surfaces of the LM SANDWICH PAD through a thermal nanoimprint device (PP-HENIL-02, Nanjing Pengpai New Material Technology Co., Ltd). Infrared thermal images of the same phone were obtained by an FLIR E4 camera
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