Abstract
Based on the one-dimensional analytical thermal model for N strata stacked chips without through-silicon via (TSV), the equivalent thermal model for TSV is presented in this paper. And then, the corresponding analytical thermal model with considering TSV is deriveed. Finally, Matlab software is used to verify and analyze the influence of TSV on the thermal management of 3D IC intergration. The analysis results indicate that the TSV can effectively improve the heat dissipation of 3D IC circuits, and the increase of TSVss pitch can raise the temperature of the 3D IC circuit.
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