Abstract
A mass diffusion model is developed to describe the growth kinetics of Cu6Sn5 intermetallic compounds (IMC) in the Cu-Sn-Cu sandwich structure. The proposed model is based on the local interfacial mass conversation law where interfacial Cu/Sn reactions and atomic diffusion are considered. Theoretical analysis shows that the IMC thickness growth is proportional to the square root of the product of the diffusion coefficient and time. The proposed model can explain the polarity effect of electromigration on kinetics of IMC growth where all the parameters have clear physical meaning. The theoretical predictions are compared with experimental results and show reasonable accuracy.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have