Abstract
Transient electronic systems are engineered to physically disappear after a predetermined period. Such systems hold significant promise for environmental sustainability and medical applications. The transient behavior relies on the interplay between water diffusion and the hydrolysis reaction of the device components, with the thickness of the encapsulation layer serving as a crucial parameter for controlling the lifetime of the device. The established analytical model for reactive diffusion, however, is limited to relatively thin encapsulation layers. We extend the analytical model to thick encapsulation layers in order to predict transient electronics’ lifetimes for both thin and thick encapsulation layers, broadening its applicability. Furthermore, we obtain a scaling law between the dissolution time and the dissolved thickness of transient electronics for the limit of a thick encapsulation layer with no reaction. This scaling law offers a robust way for calculating the dissolution time across different device configurations.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.