Abstract

The diffusion bonding titanium alloy laminates with preset unbonded area (DBTALPUA) compared with other titanium alloy structural forms has good damage tolerance performance and designability. It is important to fast get the damage estimation of the DBTALPUA with crack. The stress intensity factor (SIF) of the crack is an effective indicator to give the damage estimation. In order to get the SIF fast, this paper proposed an analytical model to calculate SIF for single hole-edge crack in DBTALPUA with hole under tension loading. Comparison of the results obtained through this analytical model and numerical simulation illustrated that the analytical model can rapidly predict the SIF with fine precision.

Highlights

  • Titanium alloys are widely used in aeronautical structures for its prominently high specific strength, excellent corrosion resistance, and high temperature properties [1,2,3,4]

  • Titanium alloys are susceptible to initiated cracks, i.e., its residual crack growth life is very short after a crack occurs, which has low damage tolerance performance [5,6,7,8]

  • An analytical model was presented in this paper to calculate stress intensity factor (SIF) distribution for single hole-edge crack in DBTALPUA with hole under tension loading

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Summary

Introduction

Titanium alloys are widely used in aeronautical structures for its prominently high specific strength, excellent corrosion resistance, and high temperature properties [1,2,3,4]. Based on the above characteristics, Wang [13] proposed a type of structure to improve damage tolerance of titanium alloy base on the diffusion bonding laminates. They set the solder mask on the sheets at specific location before the diffusion bonding process. Reference [15] built the numerical analysis model for the fatigue failure process of the DBTALPUAs, and obtained the unbonded area effect law to the crack growth life of the laminates in parameter analysis. According to the fatigue failure process and existing formula for 3-D crack [21], we proposed the analytical model to calculate the SIF distribution for single hole-edge crack in DBTALPUA with hole under tension loading.

Specimen
Test Conditions and Procedures
The Expression of K
Validation of Formula
The Trace Line Modeling
Finite Element Modeling
The Analysis of the First Stage during the Crack Growth Process
The Analysis of the Second Stage during the Crack Growth Process
The Analysis of the Third Stage during the Crack Growth Process
Findings
Conclusions
Full Text
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