Abstract
The pulsed vacuum arc plasma have been using as media for spraying of copper and aluminum cathodes. The product of cathode erosion was deposited on the substrates made from crystalline silicon and stainless steel. A porous metal thick layers on the silicon substrate, that consist of spherical hollow particles were obtained. The continuous growing films and large particles on the metal surface as well as a number of cavities on the silicon surface were observed. The process of larger micron-sized particles formed from hundreds of nanoscale ones was observed. The difference of layer structure on surfaces can be explain that a morphology of the original surface affects the size of the deposited particles. The role of cathode drops and buffer plasma in deposition process discussed.
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