Abstract
Rapid and contactless defect characterization is a very desirable goal in most current technologies. We will describe the contactless, resonant-coupled photoconductive decay (RCPCD) technique, as applied to a variety of wafer and thin-film materials. Using this technique, we can measure recombination lifetime over many decades of injection level. We can also measure relative values of minority-carrier mobility and diffusion length. By scanning the excitation wavelength, we can measure spectral response and photoconductive excitation spectra. Deep-level impurities can also be detected by several variations of RCPCD. We will show the general versatility of this technique.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.