Abstract

Rapid and contactless defect characterization is a very desirable goal in most current technologies. We will describe the contactless, resonant-coupled photoconductive decay (RCPCD) technique, as applied to a variety of wafer and thin-film materials. Using this technique, we can measure recombination lifetime over many decades of injection level. We can also measure relative values of minority-carrier mobility and diffusion length. By scanning the excitation wavelength, we can measure spectral response and photoconductive excitation spectra. Deep-level impurities can also be detected by several variations of RCPCD. We will show the general versatility of this technique.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.