An adjustable Ar ion-beam activation strategy to achieve hydrophilic bonding of Si and diamond by deposited AlN interlayer

Abstract

As a III-nitride, AlN exhibits high thermal conductivity, excellent insulation, and low thermal expansion. Therefore, AlN is an alternative to the insulating layer in conventional Si-on-insulator (SOI) systems to solve the problem of severe self-heating effects caused by the poor thermal conductivity of buried oxide (BOX, SiO2) layers. This is particularly true for high-power integrated circuit and micro-electro-mechanical system fabrication. However, heat transfer also depends on the bottom Si substrate. With the highest thermal conductivity (≥2000 W/mK) among bulk materials, diamond is a highly attractive option to replace conventional Si substrates. Herein, we describe a low-temperature vacuum-free hydrophilic bonding method based on a thin AlN interlayer to prepare a single-crystal Si layer on a polycrystalline diamond. Through suitable Ar ion-beam activation, the surface nanomorphology and chemical state can be simultaneously modified. Increasing the real contact area and removing the surface heavy oxygen layer are critical factors for achieving complete bonding. Moreover, the relatively mild deposition and bonding conditions of AlN make it compatible with the complex CMOS transistor process and could enable the more flexible integration of diamond into 3D chip packages in the future.