Abstract

Internal friction in aluminum thin films on silicon substrates has been measured between 180 and 360 K as a function of strain amplitude. The amplitude dependence of internal friction in the aluminum films has been evaluated from the data on the film-substrate composite and further converted into the plastic strain of the order of 10 -9 as a function of the effective stress on dislocation motion. The microplastic stress-strain curves thus obtained for the aluminum films tend to shift to a higher stress with decreasing film thickness and also with decreasing temperature. It is concluded that the microflow stress at a constant level of the plastic strain varies inversely with the film thickness at all the temperatures examined.

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