Abstract

We studied precipitation of oxygen in the region below the buried oxide of a silicon-on-insulator structure formed by high-dose implantation of oxygen. Underneath the oxide layer there is first a region containing amorphous precipitates, spherical in shape. At greater depth, platelike precipitates of the monoclinic silica phase coesite are observed on {113} silicon planes. The lower interface of the buried oxide is very rough compared to the upper interface. The morphology of the implanted structure is attributed to intrinsic point defects. In particular it is proposed that a high concentration of self-interstitials occurs below the oxide as soon as it becomes a continuous layer. This leads to a large reduction of the oxidation rate in this region. Oxidation then only occurs above the buried oxide, reducing the thickness of the superficial silicon film.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.