Abstract
ABSTRACTPortable models based on the latest liquid crystal displays (LCDs) have been useful in various areas. Many developers have pursued thinner hardware as well as the advanced performance of portable models. Therefore, as the panel glass continuously becomes thinner, the strength characteristics of glass are highlighted as an important issue. In particular, the strength of the LCD glass is mentioned as an important issue. The occurrence of surface scratches on the active-matrix liquid crystal display glass substrates should be minimized to produce portable models with stability; if their crack flaw sizes are kept below a certain level or close to zero, strength-differentiated LCD panel production will be possible. This study confirmed that in LCD panels where the thin-film transistor-color filter (TFT-CF) is assembled, cracks are generated mainly in the TFT glass, and the mirror constant is at a 60.038 MPaċmm0.5 level. In addition, this suggests that the size of the crack flaws that may occur on the glass surfaces during the LCD process should be minimized to produce panels that can withstand a certain impact level through the fracture surface analysis of the glass crack origins.
Highlights
Studies on the crack occurrence on the active-matrix liquid crystal display glass substrates have been continuously conducted, and various data have been reported
The occurrence of surface scratches on the active-matrix liquid crystal display glass substrates should be minimized to produce portable models with stability; if their crack flaw sizes are kept below a certain level or close to zero, strength-differentiated liquid crystal displays (LCDs) panel production will be possible
After confirming the crack flaws, mirror radius, and fracture stress on the fracture surface of the TFT glass where cracks occurred, the results shown in Table 1 were observed
Summary
Studies on the crack occurrence on the active-matrix liquid crystal display (hereinafter, ‘AMLCD’) glass substrates have been continuously conducted, and various data have been reported. In the final glass substrates that become products in practice, several factors during the liquid crystal display (hereinafter, ‘LCD’) process change the material properties of the substrates and have a decisive effect on the fracture stress depending on the management of the flaws on the substrate surfaces when the panel cracks occur. The microscratches that occur on the glass surfaces during the LCD panel production become the crack origins in the panels; the degree of stress that causes the glass to be destroyed changes in accordance with the flaw size. The results were observed using an optical microscope (SEC-2000) to determine the fracture dimensions and the forms of the crack origins of the samples from the completed experiment
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