Alternative Placement Systems for Three-Dimensional Circuit Boards

Abstract

The three dimensional circuit board technology leads to advantages and new special challenges concerning electronics assembly. Two different placement systems were realized at the FAPS institute. The first concept was developed to extend the limits of a Cartesian Placement System. An advanced module for handling the Molded-Interconnect-Device-Technology (MID) in the working space of a SMD assembling system, as well as the use of a pipette with an additional axis, make the 3-dimensional assembly of components into MID possible. The second concept is a Robot Placement System, which consists of hardware components like a six axis robot, a tool changing system, a transport system, moving feeders and a vision system. A critical point in surface mounted technology is the necessary accuracy in centering the SMD to the pipette and the accurate placement of components. This is realized with the use of vision systems. Thereby, a new strategy for failure compensation was developed. A way to optimize the control structures and kinematic of MID placement systems is the use of modern simulation-based development and test systems, which provide facilities to perform structural analysis, collision detection, cycle time calculation as well as off-line programming capabilities.