Abstract
This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication tcchnologics appropriate for robust MEMS arc illustrated through three examples: wireless micromachined ceramic pressure sensors for high temperature application in turbine compressors; micromachined stainless steel pressure sensor arrays; and micromachined stainless steel modulators for synthetic jets intended for aerodynamic control applications.
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